Item

DESCRIPTION

1

Blue M 0V-12A Baking Oven, 17" X 17", 110V-1P, 8A

2

Micro Scan w/Computer Laser based measurement

3

NEC Robotics Engineering LTD Film Alignment Lamination (FAL) System

4

Cox Automation Systems 2700-Snow Leopard Laser Patch Repair System w/cart

5

Grohmann Engineering HOC-580 Flip Chip Module SI Thermocompression Flip Chip Bonder and Feeder, 95" X 186" X 92", 480V, AC, (2) Heated Bond Heads 100K Force, X-Axis 60", Y-Axis 36", Z-Axis 1", Substraight Transfer System

6

Grohmann Engineering HOC-580 Heavy Wire Bonder Module SI Wire Bonder, 188" X 111" X 92", 480V, AC, 36" x 60" Axis Cap., (2) Orthodynecl Electronics Model M360C Heavy Wire Bonders

7

Grohmann Engineering SMD Placement SI SMD Placement, 102" X 110" X 92", 480V, AC, including part of SMD Placement Machine, 36" x 60" Axis Cap., (54) Pick in Place Heads, (4) 3D Pick in Place Heads

8

Grohmann Engineering HOC-580 Compression Print Module SI Printer, 84" X 118" X 92", 480V, AC, 36" x 60" Cap., Automatic Stencil Exchange System, Printing Head/Gantry System

9

Grohmann Engineering HOC-580 Laser Solder Module SI Laser, 88" X 267" X 92", 480V, AC AND SI Laser - 3-D MANIPULATOR AND 36" x 60" Cap., (6) Laser Heads, (5) 2D Laser Heads, (1) 3D Laser Head, (2) 30 Watt Lasers on Each Head, (2) Lauda Model WK1200 Water Chillers

10

Conceptronic APPOLLO SI Reflow Oven (Large Conceptronic), 90" X 315" X 69", 480V-3P, 356A - Maxium; 150A - stable operation, 36" x 315", Speeds 0-100 Inch Per Minute, Temp. Range 22 Deg. C to 300 Deg. C, 14 Heating Zones, 4 Cooling Zones, Lead Free Capability

11

LOT of (8) THK Co. Ltd. FWB50110R SI Grohmann Cart #6, 46" X 66" X 38" Cart #7 Cart #8 and Cart # 1: 46" X 66" X 38", Cart # 5 66" X 46"